来源:《安全与电磁兼容》2020年    作者:Min Miao, Huan Liu

Three-dimensional integration technology based on through silicon via (TSV) has been widely accepted as an advanced integration and packaging technology. In this paper, two methods to evaluate the noise coupling in the TSV interconnection channel are explained, and their characteristics and applicability are illustrated. The methods to suppress the noise from the perspective of hardware and software are introduced. Moreover, a channel coding scheme for suppressing the noise in the TSV interconnection channel is described in detail.

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