来源:《安全与电磁兼容》2020年    作者:Etienne SICARD, Alexandre BOYER

This paper introduces the main trends in the integrated circuit manufacturing industry, the driving forces in relation to complexity, operating frequency, device performance, trends in supply voltages and data rate exchange between devices. The roadmap summarizes IC performance in terms of technology nodes, ranging from micron to nano scales and targeting CMOS technology. The consequences of this technological evolution on electromagnetic compatibility (EMC) of ICs are also discussed, with focus on parasitic emission and susceptibility to radio-frequency interference.

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